MINNEAPOLIS, USA: FSI International Inc., a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, announced that it gained acceptance for an ORION Single Wafer Cleaning System from a leading Asian foundry producer. The customer has qualified the system for front-end-of-line (FEOL) 28 nanometer cleaning processes and will use it for all-wet photoresist stripping applications using the high-temperature ViPR process. The company expects to recognize revenue for this system in the first quarter of fiscal 2012.
Several leading integrated circuit manufacturers are finding that the unique closed chamber design of the ORION System permits safe use of aggressive, high-temperature ViPR process technology for all-wet removal of highly implanted photoresist. FSI's differentiated ViPR technology minimizes material loss, lowers defectivity and has proven cost of ownership advantages. The process chamber design with an integrated spray bar, improves uniformity, shortens process time, reduces chemical consumption and enhances particle removal.
FSI International is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray, vapor and cryogenic aerosol technologies, customers are able to achieve their process performance flexibility and productivity goals. The company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment.